| Project | Parameter | |
| Min width & space | 0.075/0.075mm | |
| Inner copper thickness | ≥1/3 OZ，≤6 OZ | |
| Inner core material thickness | ≥0.075mm | |
| Min hole | Machinery hole | 0.15mm |
| Laser hole | 0.10mm | |
| Min distance from hole to line |
PTH | 0.15mm |
| NPTH | 0.125mm | |
| Max board size | 544×622mm | |
| Max board Layer | 28L | |
| Board thickness | 0.3~4.0mm | |
| Board thickness tolerance | ±8% | |
| HDI(combination) | 1+N+1 2+N+2 | |
| Deep plate capability | Through-hole | 10:01 |
| Blind hole | 1.25:1 | |
| Finished hole tolerance | PTH | ±0.075mm |
| NPTH | ±0.03mm | |
| Impedance control | ±7% | |
| Finishing | OSP, ENIG, immersion Tin, HAL, HASL LF, immersion silver etc. | |
| Plating copper thickness | ≥25mm | |
| Gold nickel thickness | Gold layer thickness | 0.03~0.1um |
| Nickel layer thickness | 2.5~8um | |
| Golden finger | Gold layer thickness | 0.76~1.5um |
| Nickel layer thickness | 2.5~5um | |
| HAL LF thickness | 2~50um | |
| Chemical immersion tin thickness | 0.8~1.2um | |
| OSP film thickness | 0.2~0.5um | |
| V-CUT depth control tolerance | ±0.05mm | |
| V-CUT angle | 30℃，45 ℃ ，60 ℃ | |
| SMT size | 0.3mm | |
| BGA size | 0.2mm | |
| Min surfacing tolerance | 0.05mm | |
| Twist tolerance | ±0.5% | |
