Mobile devices such as smartphones and tablet computers is growing at a furious pace. Because mobile devices are getting smaller and smaller, faster and faster, with more and more light weight, the price is cheaper and cheaper, at the same time is becoming more and more, and more complex, and the parts manufacturing to miniaturization and motors. For some of the key components, such as semiconductor chips, microelectronics packaging, touch screen and printed circuit boards (PCBs), they will continue to face challenges, such as improve the yield and productivity, but also reduce the cost. It promotes the laser is widely used in mobile equipment manufacturing. Because the equipment is becoming more and more complex, so need more and more complex manufacturing process, the research progress of laser light source is also put forward higher requirements.

With shorter wavelength and pulse duration and low M2 (laser beam quality) can create a light spot focus more focused, and can keep the minimum heat affected zone (HAZ), so as to realize more sophisticated micro machining. High energy absorption, especially in the ultraviolet (UV) wavelength and short pulse range, the material will be rapidly vaporized, reducing heat affected zone and carbonization. Small focal sp can achieve higher precision, smaller processing. High power, high pulse repetition frequency (PRF), pulse shaping and pulse splitting can contribute to improve the micro machining productivity. Sustained high pulse stable performance to ensure repeatability of the process, help to achieve a higher rate.

Traditional uv Q switch diode pumped solid state (DPSS) lasers can reasonably meet the requirements of precision manufacturing, but they are in higher processing speed and higher micro machining quality and lacking. Commonly used method to increase processing speed is while keeping other parameters constant increase of the laser pulse repetition frequency. However, for the typical Q switch DPSS laser, this is not possible. Average power and pulse of the laser energy is increased with the increase of pulse repetition frequency drops rapidly. In addition, the high pulse repetition frequency, laser pulse width and pulse energy fluctuations tend to be greatly increased.

Use ultraviolet laser for a variety of common microelectronics materials (including silicon, ceramics, glass, copper) of bulk processing, can bring many benefits. By expanding process parameter space (under the high pulse repetition frequency increase power), plus advanced pulse division and plastic technology, we can improve the processing speed and obtain micro processing quality improvement. With proper parameter optimization, the use of this new uv nanosecond pulse laser source can get better quality and higher productivity, to improve the ability of laser micro processing, now to face the future for consumer electronics manufacturing put forward higher challenge